Manufacturing Today Issue - 241 October 2025 | Page 86

Pragmatic’ s long-term collaboration with CPI comes as limitations on the costs and physical properties of traditional, silicon-based circuits are stalling the next wave of innovation. To address this challenge, a revolutionary approach to semiconductor fabrication is essential and enables the creation of a smarter future. By manufacturing integrated circuits that are thinner, more robust, and more affordable, technology can be seamlessly integrated into everyday objects, which unlocks significant benefits. As a global leader in ultra-low-cost flexible electronics, Pragmatic leverages its flexible integrated circuit technology, known as FlexIC, to seamlessly integrate intelligence into a wide range of objects, including packaging and fast-moving consumer goods. This advancement helps deliver the Internet of Things( IoT), allowing organizations to collect, process, and output data throughout an object’ s lifecycle.
With rapid cycle times that substantially accelerate time to market, Pragmatic’ s FlexIC foundry delivers high-volume fabrication at a fraction of the cost of traditional silicon chips and with a significantly lower environmental impact. CPI’ s state-ofthe-art facilities, technical expertise, and industrial knowledge have played a key role in accelerating and de-risking Pragmatic’ s transition from lab-based proof of concept to commercial fabrication. The partnership has provided extensive support in transforming Pragmatic’ s manufacturing process into a scalable model and in developing a resilient production methodology.
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