_______________________________________________________________________________________ UNICOM Engineering
▲ Rusty Cone, General Manager
of deployment models. At its core, the company builds and integrates customized systems for solution providers looking to deploy their software into enterprise environments on physical infrastructure around the world. As AI workloads have become more compute-intensive and power-dense, UNICOM Engineering has expanded its focus to include advanced cooling architectures, including direct-tochip and immersion. These capabilities are designed to support higher-density deployments across both enterprise and edge data centers. Together, these areas reflect how UNICOM Engineering’ s offerings continue to evolve in response to changing workload and deployment requirements. Rusty tells us more about how UNICOM Engineering has adapted its product and technology development to align with the rapid adoption of AI solutions across several sectors.
“ At the foundational level, everything we do starts with the GPU or CPU,” he says.“ We have had a nearly 30-year relationship with Intel and, over the past decade, have extended that to work with NVIDIA and AMD as they have become key providers for AI computing. Our engineering leadership and technologists have always been focused on designing platforms around the most advanced and most in-demand processors. That was true when we were building specialized compute and storage infrastructure, and it remains true today.
“ As silicon densities have increased, so too has the amount of heat those chips dissipate, driving increased interest in liquid cooling technologies,” Rusty explains.“ We have supported air-cooled designs, as well as more advanced liquid-assisted and full immersion cooling architectures. Our platform designs are aligned with the latest advancements from leading chip manufacturers such as NVIDIA, Intel, and AMD. Consequently, we’ ve continued to evolve our design work
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