_____________________________________________________________________
Heraeus
▲ Dr Michael Jörger, Global Head of Technology
Reinvent Possible
FIRST FLUXLESS TCB IN VOLUME PRODUCTION
PRECISION OXIDE REDUCTION VIA PLASMA & FORMIC ACID
Fluxless Thermo-Compression Bonding with:
• High volume production( scores of tools at multiple sites)
• Multiple oxide cleaning options
• Highest accuracy TCB equipment- < 10 µ m pitch POC
• Lowest oxygen bonding chamber- < 30 ppm O₂
• Advanced data analytics for process control
• Complete process portability
• Industry leading ease of use
• Worldwide industry leading process support
• Advanced patented processes
• Highest throughput bonding solutions for panel and wafer level packages
• Optimal solutions for bumping, wire bonding and vertical wire applications
• Power-C™ Plus with best CoO
• High throughput for maximum productivity
• Best reliability
• Fastest time to market
WAFER LEVEL BONDER FOR COST-EFFECTIVE MEMORY PACKAGING
COST-PERFORMANCE WEDGE BONDER FOR POWER DISCRETE APPLICATIONS
HIGH-PERFORMANCE WEDGE BONDER FOR ADVANCED POWER DEVICES
ENABLING AI FOR A SMARTER FUTURE
Visit us at www. kns. com for more information
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