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Interconnect process engineer working on advanced optoelectronic packaging.“ Between 1989-1997 at CIL, I moved through Design Manager, Technical Manager, Production Director and Operations Director. On the morning of 9 / 11 – not a day you forget – I became Managing Director.” After 47 years’ experience in the industry, he tells us his thoughts on AI and job security:“ The threat from AI is out there for everyone, but people forget that in semiconductor packaging, we’ re creating the technology in the first place. We are involved in AI infrastructure ranging from the processors, motherboards and GaN power supplies that run them; someone has to make it somewhere!”
Regarding the business’ monumental growth, John reveals there has been a notable shift since the pandemic.“ As the global semiconductor crisis hit in 2023, every company started examining its exposure to its own supply chain – particularly China. They haven’ t necessarily pulled existing
production back, but the next generation of products is increasingly being designed for UK or European manufacture from the outset, provided we can hit the numbers, quality, price and delivery.” CIL’ s facility remained open throughout the Covid-19 pandemic, after it was given key worker status manufacturing medical semiconductor packaging for a customer. The company has also been involved in several Innovate UK and Advanced Propulsion Centre( APC) projects, partly funded by UK Government, around electrifying automotive vehicles.“ At our peak we had around 11 funded projects running, the largest being APC15 @ Future BEV with BMW,” he continues.“ That combined funding let us invest in capital equipment we couldn’ t otherwise have afforded, expanding our process capability significantly. As the funded projects have concluded, CIL has continued the high level of investment”
CIL customers can expect a wide scope of deliverables, solutions and innovations.
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