________________________________________________________________________________________________________________________
Total
Solution for Dicing, Grinding and Polishing
Blade Dicing ● Grinding ● Polishing ● Laser Processing Plasma ● Surface Planarization ● Tape Lamination Optical Inspection( AOI) ● Dicing-Grinding Service
DISCO is a leading solution provider for Dicing( Kiru), Grinding( Kezuru) and Polishing( Migaku) technologies. Dicing-Grinding Service and Camtek optical inspection service( AOI) are available in our cleanrooms in Munich.
DISCO HI-TEC EUROPE GmbH Liebigstr. 8, 85551 Kirchheim b. München, GERMANY contactsales @ discoeurope. com www. discoeurope. com | www. dicing-grinding. com
John highlights how reshoring can make all the difference for clients:“ For one customer, a packaged semiconductor device used to pass through 11 different countries before reaching us but we’ ve since reduced that to three, significantly cutting their risk exposure and ensuring they get their product.” On technology, CIL offers something that many customers have never seen before – wafer bumping.“ About eight years ago, semiconductor assembly shifted from traditional wire bonding, which CIL also does at a rate of 1.5 million wire bonds per week, to attaching solder balls directly to the die at wafer level, then dicing and flipping them to become surface mount devices,” describes John.
“ We installed a PacTech SB2 + triple laser wafer bumper – the only one in the UK – and offer device bumping in five alloys: three RoHS-compliant( SAC305, SAC405, SAC-Q), Tin / Lead for military, defense, space and jet engine applications, and Bismuth alloy for
204